$210.00 (USA and Canada only)
SNAP-IDC-16
SNAP-IDC-HT-16
SNAP-IAC-16
SNAP-IAC-A-16
SNAP-IAC-K-16
Input Range
10–32 VDC/VAC
15–28 VDC/VAC
90–140 VAC/VDC
180–280 VAC/VDC
70–130 VAC/VDC
Nominal Voltage Range
24 VDC
120 VAC
240 VAC
100 VAC
Input Resistance
44 K ohms
4 K ohms
300 K ohms
940 K ohms
220 K ohms
Logic Voltage and Current
5 VDC ± 0.1 @ 150 mA
Input Arrangement
16 isolated input channels
Channel-to-Channel Isolation
250 V steady-state, 1500 V transient
Maximum Operating Common Mode Voltage
250 V
Isolation: Field to Logic
1500 V
Maximum Number of HDD Modules on One Mounting Rack
16
Indicators
None; use optional OptoTerminal-G20 diagnostic display.
ON Voltage
10 VDC @ 0.230 mA
15 VDC @ 3.50 mA
90 VAC/VDC @ 0.3 mA
180 VAC/VDC @ 0.191 mA
70 VAC/VDC @ 0.3 mA
OFF Voltage
3 VDC @ 0.05 mA
9 VDC @ 2.0 mA
40 VAC/VDC @ 0.135 mA
40 VAC/VDC @ 0.043 mA
30 VAC/VDC @ 0.135 mA
Torque, hold-down screws
4 in-lb (0.45 N-m)
Torque, connector screws
5.26 in-lb (0.6 N-m)
Polling time from I/O processor to module1
2–30 ms typical2
Input Turn-On/Off Time
15 ms turn-on time 20 ms turn-off time
20 ms turn-on time 25 ms turn-off time
Counting Frequency (DC input)
0–25 Hz @ 50% duty cycle
0–15 Hz @ 50% duty cycle
Operating Temperature
-20 to 70 °C
Storage Temperature
-40 to 85 °C
Agency Approvals
UL, CE, RoHS, DFARS
CE, RoHS, DFARS
Warranty
Lifetime
1 Affects turn-on and turn-off determination 2 Time varies based on the SNAP PAC I/O processor (brain or on-the-rack controller), processor configuration, and Ethernet host communication activity.
This document shows which SNAP I/O modules, breakout boards, and cables can be used together.
This document compares 4-channel and high-density SNAP digital I/O modules.
This document lists and describes all Opto 22 SNAP PAC System part numbers, including PAC Project software, SNAP PAC controllers, SNAP PAC brains, and SNAP I/O modules of all kinds. SNAP PAC mounting racks and SNAP power supplies are also listed.
SNAP I/O high-density digital modules from Opto 22 provide 16 or 32 digital input or output points in one compact SNAP module. These modules are ideal for OEMs and others who have high point-count applications, or for anyone requiring more than 64 digital points on a single SNAP PAC rack. The high-density configuration reduces per-point costs of digital I/O systems by providing up to eight times as many I/O points in the same space. SNAP high-density digital modules are part of the SNAP PAC System. They can also be used as part of intelligent remote I/O with an Allen-Bradley Logix PLC system. HDD modules require a SNAP PAC R-series controller or a SNAP PAC brain for I/O processing. This data sheet covers the following modules:
This guide covers how to install and test SNAP 16-channel and 32-channel digital modules, part of the SNAP PAC System. These modules provide 16 or 32 points of digital input or digital output in the same space as a 4-channel digital module. They are ideal for OEMs and for anyone who needs up to 512 digital points on a single mounting rack. SNAP high-density digital modules include the following part numbers:
This document is the Manufacturer's Declaration of Conformity for the products listed herein, in accordance with European, international, and/or national standards and regulations.
This document is a statement of compliance with the EU Directive 2015/863/EU, Restriction of Hazardous Substances (RoHS 3). This document lists Opto 22 products that comply with the substance restrictions of the RoHS 3 directive.
This document lists all Opto 22 part numbers that have the Underwriters Laboratory (UL) approval.
This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.
This CAD file includes one 3D drawing that can be used for these 16-channel SNAP digital input modules: the SNAP-IAC-16, the SNAP-IAC-A-16, and the SNAP-IDC-16. Each module provides channel-to-channel isolation.
This overview describes the four integrated components of the SNAP PAC system: software, controllers, brains and I/O. This hardware and software system is designed for industrial control, remote monitoring and data acquisition.
A quick overview on securing a SNAP Module to a SNAP rack.
A quick overview on removing a SNAP module.
What's the difference between accuracy and resolution in analog I/O specifications? Try your own specs in the calculator.
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