SNAP-IDC-32N

$198.00 (USA and Canada only)

Availability: In stock
SNAP 32-channel Digital (Discrete) Input Module, -10 to -32 VDC, with positive common connection

Please call (800) 321-6786 to order.

SNAP-IDC-32N

Production Specification

The SNAP-IDC-32N 32-channel digital input module provides 32 digital input channels in one compact SNAP module. The SNAP-IDC-32N is ideal for OEMs and others who have applications with high point counts, or for those requiring large numbers of digital input channels on one SNAP I/O rack. The high-density configuration reduces per-point costs of digital I/O systems by providing up to eight times as many I/O channels in the same space.

The SNAP-IDC-32N has an input range of -10 to -32 VDC, and its common connections are positive rather than negative, making it ideal for NPN or sinking type inputs.

Part of the SNAP PAC System, the module mounts on a SNAP PAC rack with a SNAP PAC brain or rack-mounted controller. Analog, digital, and serial I/O modules can all be on the same rack. Such an I/O unit is also well suited for PC-based control or for use as intelligent remote I/O for an Allen-Bradley Logix PLC system, such as ControlLogix, MicroLogix, or CompactLogix.

For easy field wiring, use the SNAP-IDC-HDB or compact SNAP-UDC-HDB breakout rack and the SNAP-HD-BF6 header cable. A wiring harness with flying leads (SNAP-HD-CBF6) is also available.

For sensing signals with higher current, see the SNAP-UDC-HDB-G4 breakout board, which mounts G4 input modules that handle up to 3 amps per point (G4 modules are sold separately).

If you need a similar module with a lower input range, see the SNAP-IDC-32DN.

If you need a similar module with positive inputs and negative common connections instead, see the SNAP-IDC-32.

Reference Charts: Build your system in the SNAP I/O Configurator.

 

SNAP-IDC-32
SNAP-IDC-32-FM

SNAP-IDC-32N

SNAP-IDC-32D

SNAP-IDC-32DN

Input Range

10 to 32 VDC

-10 to -32 VDC

2.5 to 12 VDC

-2.5 to -12 VDC

Nominal Voltage Range

24 VDC

-12 to -24 VDC

2.5 VDC

-2.5 VDC

Input Resistance

20 K ohms

20 K ohms

3 K ohms

3 K ohms

Logic Voltage and Current

5 VDC ± 0.1 @ 150 mA

5 VDC ± 0.1 @ 150 mA

Maximum Operating
Common Mode Voltage

250 V

250 V

250 V

250 V

Isolation: Field to Logic

1500 V

1500 V

1500 V

1500 V

Input Arrangement

32 input channels; 4 groups of 8 inputs each

32 input channels; 4 groups of 8 inputs each

Common connection

Points in each group share a common
negative connection.

Points in each group share a common
positive connection.

Points in each group share a common
negative connection.

Points in each group share a common
positive connection.

Channel-to-Channel Isola­tion

No channel-to-channel isolation;
100 V group-to-group isolation

No channel-to-channel isolation;
100 V group-to-group isolation

Hold-down screws
Connector screws

Torque: 4 in-lb (0.45 N-m)
Torque: 5.26 in-lb (0.6 N-m)

Torque: 4 in-lb (0.45 N-m)
Torque: 5.26 in-lb (0.6 N-m)

Maximum Number of HDD Modules on One Mounting Rack

16

16

16

16

Indicators

None; use optional OptoTerminal-G20 diagnostic display or breakout rack.

ON Voltage

10 VDC @ 0.5 mA

-10 VDC @ 0.5 mA

2.5 VDC @ 0.5 mA

-2.5 VDC @ 0.5 mA

OFF Voltage

3 VDC @ 0.1 mA

-3 VDC @ 0.1 mA

1 VDC @ 0.1 mA

-1 VDC @ 0.1 mA

Polling time from I/O pro­cessor to module1

2–30 ms typical2

2–30 ms typical2

2–30 ms typical2

2–30 ms typical2

Input Turn-On/Off Time

6 ms

6 ms

6 ms

6 ms

Counting Frequency
(DC input)

0–50 Hz @ 50% duty cycle

0–50 Hz @ 50% duty cycle

0–50 Hz @ 50% duty cycle

0–50 Hz @ 50% duty cycle

Operating Temperature

-20 to 70 °C

-20 to 70 °C

-20 to 70 °C

-20 to 70 °C

Storage Temperature

-40 to 85 °C

-40 to 85 °C

-40 to 85 °C

-40 to 85 °C

Agency Approvals

UL, CE, RoHS, DFARS

FM (-FM model only)

CE, RoHS, DFARS

CE, RoHS, DFARS

CE, RoHS, DFARS

Warranty

Lifetime

Lifetime

Lifetime

Lifetime

1 Affects turn-on and turn-off determination
2 Time varies based on the SNAP PAC I/O processor (brain or on-the-rack controller), processor configuration, and Ethernet host communication activity.

Modules, Cables, and Breakout Boards Compatibility Charts

This document shows which SNAP I/O modules, breakout boards, and cables can be used together.

Comparison Chart: SNAP 4-Channel and High-Density Digital Modules

This document compares 4-channel and high-density SNAP digital I/O modules.

SNAP PAC System Product Guide

This document lists and describes all Opto 22 SNAP PAC System part numbers, including PAC Project software, SNAP PAC controllers, SNAP PAC brains, and SNAP I/O modules of all kinds. SNAP PAC mounting racks and SNAP power supplies are also listed.

SNAP High-Density Digital Modules Data Sheet

SNAP I/O high-density digital modules from Opto 22 provide 16 or 32 digital input or output points in one compact SNAP module. These modules are ideal for OEMs and others who have high point-count applications, or for anyone requiring more than 64 digital points on a single SNAP PAC rack. The high-density configuration reduces per-point costs of digital I/O systems by providing up to eight times as many I/O points in the same space.

SNAP high-density digital modules are part of the SNAP PAC System. They can also be used as part of intelligent remote I/O with an Allen-Bradley Logix PLC system.

HDD modules require a SNAP PAC R-series controller or a SNAP PAC brain for I/O processing. These modules work with standard wired controllers and brains and with Wired+Wireless models.

SNAP High-Density Digital Module User's Guide

This guide covers how to install and test SNAP 16-channel and 32-channel digital modules. These modules provide 16 or 32 points of digital input or digital output in the same space as a 4-channel digital module. They are ideal for OEMs and for anyone who needs up to 512 digital points on a single mounting rack.

Declaration of Conformity (LVD, RoHS)

This document is the Manufacturer's Declaration of Conformity for the products listed herein, in accordance with European, international, and/or national standards and regulations.

New I/O Breakout Boards Increase Current Switching Up to 12x, Simplify Wiring, and Save Panel Space

Press release for SNAP-UDC-HDB-G4 and SNAP-UDC-HDB breakout racks for SNAP 32-point SNAP digital I/O modules

SNAP PAC System Migration Technical Note

This document describes migration options for customers integrating the SNAP PAC System with older Opto 22 systems. It explains the SNAP PAC System's similarities and differences with earlier systems, defines legacy products, and shows how to mix old and new hardware.

Customers moving to the SNAP PAC System may also want to consult form #1693, Legacy and Current Product Comparison and Compatibility Charts.

Opto 22 RoHS 2 Statement of Compliance - Restriction of Hazardous Substances

This document is a statement of compliance with the EU Directive 2011/65/EU, Restriction of Hazardous Substances (RoHS 2). This document lists Opto 22 products that comply with the substance restrictions of the RoHS2 directive.

CE Declaration: Low Voltage

This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.

No downloads are available for this product.

Video: SNAP PAC System Overview

This overview describes the four integrated components of the SNAP PAC system: software, controllers, brains and I/O. This hardware and software system is designed for industrial control, remote monitoring and data acquisition.

Video: Securing SNAP Module

A quick overview on securing a SNAP Module to a SNAP rack.

Video: Removing a SNAP Module

A quick overview on removing a SNAP module.

Demo: Accuracy vs Resolution

What's the difference between accuracy and resolution in analog I/O specifications? Try your own specs in the calculator.