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$289.00 (USA and Canada only)

Availability: In stock
Fused breakout rack for SNAP 32-channel digital (discrete) input module

Production Specification

The SNAP-IDC-HDB breakout rack is used with one 32-channel digital input module, such as the SNAP-IDC-32. The breakout rack provides LED indicators and easily accessible fused connectors for input points.

Use the SNAP-HD-BF6 header cable for connections to the module.

If you need a more compact breakout rack, see the SNAP-UDC-HDB.

For reference: Modules, Cables, and Breakout Boards Compatibility Charts

Build your system in the SNAP I/O Configurator.

SNAP-IDC-HDB and SNAP-IDC-HDB-FM [Obsolete] Breakout Racks for High-Density Digital Input Modules

Used with

SNAP-IDC-32, SNAP-IDC-32-FM [Obsolete], SNAP-IDC-32N, and SNAP-IDC-32DN


40-pin header connects to 32-point input module using SNAP-HD-BF6 header cable.
32 signal input connectors; each signal connector has a corresponding common connector.
For each zone of 8 signal inputs, 1 connection for either module common or field common.
Wire size for field connectors: 16-20 AWG


1 LED for each signal input (32 signal LEDs total)
1 power status LED for each zone of 8 signal inputs (4 power LEDs total)


1 A fuses; 2 fuses for each zone of 8 signal inputs (8 fuses total)
Replace with Pudenz 1 A automobile mini-fuse or equivalent.


For each zone of 8 signal inputs, 1 jumper controls whether module common or field common is used.


32 VDC maximum, 12-24 VDC nominal

Agency Approvals



30 months from date of manufacture

SNAP TEX Cables and Breakout Boards Data Sheet

SNAP TEX cables and breakout boards are part of the SNAP TEX family of wiring and mounting accessories. These parts save time and expense during installation, maintenance, and debugging by reducing the time and effort required to wire field devices to SNAP I/O modules. This data sheet covers the following part numbers:

SNAP High-Density Digital Module User's Guide

This guide covers how to install and test SNAP 16-channel and 32-channel digital modules, part of the SNAP PAC System. These modules provide 16 or 32 points of digital input or digital output in the same space as a 4-channel digital module. They are ideal for OEMs and for anyone who needs up to 512 digital points on a single mounting rack. SNAP high-density digital modules include the following part numbers:

  • SNAP-IAC-16
  • SNAP-IAC-A-16
  • SNAP-IAC-K-16
  • SNAP-IDC-16
  • SNAP-IDC-32
  • SNAP-IDC-32D
  • SNAP-IDC-32N

Opto 22 RoHS 3 Statement of Compliance - Restriction of Hazardous Substances

This document is a statement of compliance with the EU Directive 2015/863/EU, Restriction of Hazardous Substances (RoHS 3). This document lists Opto 22 products that comply with the substance restrictions of the RoHS 3 directive.

SNAP-IDC-HDB Jumper Settings

This document shows the jumper settings for the SNAP-IDC-HDB, a breakout board for high-density digital input modules. Also provided are dimensions for installing the board.

UL Approval Document

This document lists all Opto 22 part numbers that have the Underwriters Laboratory (UL) approval.

CE Declaration: Low Voltage

This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.

CAD Drawing: SNAP-IDC-HDB breakout rack

This CAD file includes drawings for the SNAP-IDC-HDB, a fused breakout rack for SNAP 32-channel digital input modules such as the SNAP-IDC-32 and the SNAP-ODC-32-SNK. The rack simplifies field wiring to the module.

Video: SNAP PAC System Overview

This overview describes the four integrated components of the SNAP PAC system: software, controllers, brains and I/O. This hardware and software system is designed for industrial control, remote monitoring and data acquisition.

Video: SNAP TEX Wiring and Mounting Accessories

A quick overview of SNAP TEX wiring and mounting accessories.