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G4D32EB2
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G4D32EB2

$890.00 (USA and Canada only)

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Ethernet I/O 32-Channel G4 Digital OptoMMP Brain, Rack, and Cover
Data Sheet

Production Specification

The G4D32EB2 is a physically identical Ethernet version of the legacy G4D32RS mistic digital rack. It includes a G4EB2 brain, a G4 module mounting rack, a G4REG onboard regulator, and a metal cover.

The G4D32EB2 provides physical compatibility, I/O module compatibility, and field-wiring compatibility with the G4D32RS mistic brick. However, this brain uses a different protocol—OptoMMP instead of mistic—and different commands. If you replace a G4D32RS with the new part, you will need to change your program in order to communicate with the unit.

The G4D32EB2 is designed for extended or new applications and provides the option of using Ethernet and the OptoMMP protocol while keeping the same I/O and field wiring.

To upgrade a legacy G4D32RS brick with an Ethernet brain replacement, see the G4D32EB2-UPG.

To upgrade a legacy B4 brain, see the G4EB2.

G4EB2 Specifications

Input Power on G4D32RS with G4REG (no I/O)

24 VDC at 275 mA maximum (does not include module power requirements)

Input Power on G4PB32H or PB32HQ (no I/O)

5.0–5.2 VDC at 550 mA maximum (does not include module power requirements)

Memory

16 MB RAM

Wired Ethernet Network Interfaces

IEEE 802.3 network, 10Base-T and 100Base-TX. Automatic MDC/MDI-X crossover (Ethernet crossover cable not required for direct connection to PC). Two switched inter­faces, allowing multi-drop (daisy-chain) or standard star network configuration.

Maximum Ethernet Segment Length

100 meters with Category 5 or superior UTP.
For 100 Mbps at this distance, use Category 5 or superior solid UTP.

Backup battery for real-time clock

User replaceable BR2032 coin cell provides 10 years power off backup for system clock

Operating Temperature

0 to 70 °C

Storage Temperature

-40 to 85 °C

Humidity

0–95% humidity, non-condensing

Agency certifications

CE, RoHS, DFARS

Warranty

30 months from date of manufacture

 

Additional Specifications for G4D32EB2 Brick Base

Operating Temperature

0 to 70 °C
95% humidity, non-condensing

Interface Connectors
Field
Control
Power

  

Screw-type terminal strip accommodates up to 10 AWG wire
Boxed header accepts a G4EB2 brain board
Screw-type terminals accommodate up to 10 AWG wire

1981

G4EB2 Brain Data Sheet

The G4EB2 brain replaces a 32-channel digital brain in a serial or Pamux system with an Ethernet-based 32-channel brain that uses the OptoMMP protocol. Three part numbers are available for specific purposes.

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1465

OptoMMP Protocol Guide

This guide is for programmers who are writing custom applications to communicate with Opto 22 memory-mapped devices. These devices include groov EPIC processors, SNAP PAC controllers and SNAP PAC EB and SB brains; G4EB2 brains; SNAP Ultimate, SNAP Ethernet, and SNAP Simple I/O; E1 and E2 brain boards, and SNAP-LCE controllers.

The guide describes how to use the IEEE 1394-based OptoMMP memory-mapped protocol for programming. The guide also contains the complete memory map for all Opto 22 memory-mapped devices.

NOTE: This guide replaced previous individual programming guides for SNAP Ultimate I/O (form #1312) and SNAP Ethernet I/O (form #1227). This document was formerly called the "SNAP Ethernet-Based I/O Units Protocols and Programming Guide."

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2275

Declaration of Conformity (LVD, RoHS)

This document is the Manufacturer's Declaration of Conformity for the products listed herein, in accordance with European, international, and/or national standards and regulations.

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2014

New I/O Processors from Opto 22 Upgrade Legacy Digital I/O Systems to Ethernet

Press release for G4D32EB2-UPG, G4EB2, and G4D32EB2 Ethernet-based I/O processors, or "brains," for use with legacy mistic and Pamux digital I/O systems.

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1648

Opto 22 RoHS 3 Statement of Compliance - Restriction of Hazardous Substances

This document is a statement of compliance with the EU Directive 2015/863/EU, Restriction of Hazardous Substances (RoHS 3). This document lists Opto 22 products that comply with the substance restrictions of the RoHS 3 directive.

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0893

CE Declaration: Component

This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.

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0891

CE Declaration: Low Voltage

This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.

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Firmware for all SNAP PAC products

Firmware for all SNAP PAC products (single download)

See the README document for information on changes and fixes in the current version of this product's firmware.

Effective April 2, 2018, some SNAP PAC controllers and brains have new flash components. These units ship with firmware R9.5g (or higher) and new bootloader firmware.

PAC firmware versions R9.5f and lower are not compatible with the new component. If you inadvertently install firmware R9.5f or lower on one of these units, you can recover by using the Failsafe Bootloader Mode to install firmware R9.5g or higher.

For more information about the new flash component, see KB87213.

For details on Failsafe Bootloader Mode, see "Replacing Damaged Firmware" in the PAC Manager User's Guide (form 1704). NOTE: Opto 22 recommends that you always use the most recent release of PAC Manager.

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G4EB2 Brain Firmware

Firmware for the G4EB2 brain, including part numbers G4D32EB2 and G4D32EB2-UPG.

Note: See the README document for information on changes and fixes in the current version of this product's firmware.

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No videos or demos are available for this product.