(USA and Canada only)
10 to 32 VDC
-10 to -32 VDC
2.5 to 12 VDC
-2.5 to -12 VDC
Nominal Voltage Range
-12 to -24 VDC
20 K ohms
3 K ohms
Logic Voltage and Current
5 VDC ± 0.1 @ 150 mA
Common Mode Voltage
Isolation: Field to Logic
32 input channels; 4 groups of 8 inputs each
Points in each group share a common
Points in each group share a common
No channel-to-channel isolation;
100 V group-to-group isolation
Torque: Not to exceed 1 in-lb (0.11 N-m)
Torque: 5.22 in-lb (0.59 N-m)
Maximum Number of HDD Modules on One Mounting Rack
None; use optional OptoTerminal-G20 diagnostic display or breakout rack.
10 VDC @ 0.5 mA
-10 VDC @ 0.5 mA
2.5 VDC @ 0.5 mA
-2.5 VDC @ 0.5 mA
3 VDC @ 0.1 mA
-3 VDC @ 0.1 mA
1 VDC @ 0.1 mA
-1 VDC @ 0.1 mA
Polling time from I/O processor to module1
2–30 ms typical2
Input Turn-On/Off Time
0–50 Hz @ 50% duty cycle
-20 to 70 °C
-40 to 85 °C
UL, CE, RoHS, DFARS; UKCA
CE, RoHS, DFARS
1 Affects turn-on and turn-off determination
2 Time varies based on the SNAP PAC I/O processor (brain or on-the-rack controller), processor configuration, and Ethernet host communication activity.
This document shows which SNAP I/O modules, breakout boards, and cables can be used together.
This document compares 4-channel and high-density SNAP digital I/O modules.
This document lists and describes all current Opto 22 SNAP PAC System part numbers, including PAC Project software, SNAP PAC controllers, and SNAP I/O modules of all kinds. SNAP PAC mounting racks and SNAP power supplies are also listed.
SNAP I/O high-density digital modules from Opto 22 provide 16 or 32 digital input or output points in one compact SNAP module. These modules are ideal for OEMs and others who have high point-count applications, or for anyone requiring more than 64 digital points on a single SNAP PAC rack. The high-density configuration reduces per-point costs of digital I/O systems by providing up to eight times as many I/O points in the same space.
SNAP high-density digital modules are part of the SNAP PAC System. They can also be used as part of intelligent remote I/O with an Allen-Bradley Logix PLC system. HDD modules require a SNAP PAC R-series controller or a SNAP PAC brain for I/O processing.
This data sheet covers the following modules:
This guide covers how to install and test SNAP 16-channel and 32-channel digital modules, part of the SNAP PAC System. These modules provide 16 or 32 points of digital input or digital output in the same space as a 4-channel digital module. They are ideal for OEMs and for anyone who needs up to 512 digital points on a single mounting rack. SNAP high-density digital modules include the following part numbers:
This document is the Manufacturer's Declaration of Conformity for the products listed herein, in accordance with the rules, regulations and standards of the United Kingdom. The models cited have been tested to the essential requirements listed in the Standards section, and fully comply with the legislation as listed in UK Legislation section.
This document is the Manufacturer's Declaration of Conformity for the products listed herein, in accordance with European, international, and/or national standards and regulations.
This document describes migration options for customers integrating the SNAP PAC System with older Opto 22 systems. It explains the SNAP PAC System's similarities and differences with earlier systems, defines legacy products, and shows how to mix old and new hardware.
Customers moving to the SNAP PAC System may also want to consult form #1693, Legacy and Current Product Comparison and Compatibility Charts.
This document is a statement of compliance with the EU Directive 2015/863/EU, Restriction of Hazardous Substances (RoHS 3). This document lists Opto 22 products that comply with the substance restrictions of the RoHS 3 directive.
This technical note is for customers using SNAP high-density digital modules with ioControl 6.1 and ioDisplay 6.0.
This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.
This overview describes the four integrated components of the SNAP PAC system: software, controllers, brains and I/O. This hardware and software system is designed for industrial control, remote monitoring and data acquisition.
A quick overview on securing a SNAP Module to a SNAP rack.
A quick overview on removing a SNAP module.
What's the difference between accuracy and resolution in analog I/O specifications? Try your own specs in the calculator.