SNAP-IDC-32-FM
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SNAP-IDC-32-FM

Availability: Obsolete
OBSOLETE SNAP 32-channel Digital (Discrete) Input Module, 10-32 VDC

Production Specification

*** NOTE: This part is obsolete and no longer available. ***
Please consider SNAP-IDC-32 or contact Opto 22 Pre-Sales engineers for more information.

The SNAP-IDC-32-FM 32-channel digital input module provides 32 digital input channels in one compact SNAP module. The SNAP-IDC-32-FM is ideal for OEMs and others who have applications with high point counts, or for those requiring large numbers of digital input channels on one SNAP I/O rack. The high-density configuration reduces per-point costs of digital I/O systems by providing up to eight times as many I/O channels in the same space.

Part of the SNAP PAC System, the module mounts on a SNAP PAC rack with a SNAP PAC brain or rack-mounted controller. Analog, digital, and serial I/O modules can all be on the same rack. Such an I/O unit is also well suited for PC-based control or for use as intelligent remote I/O for an Allen-Bradley Logix PLC system, such as ControlLogix, MicroLogix, or CompactLogix.

For easy field wiring, use the SNAP-IDC-HDB or compact SNAP-UDC-HDB breakout rack and the SNAP-HD-BF6 header cable. A wiring harness with flying leads (SNAP-HD-CBF6) is also available.

Reference Charts: Build your system in the SNAP I/O Configurator.

 

SNAP-IDC-32
SNAP-IDC-32-FM [Obsolete]

SNAP-IDC-32N

SNAP-IDC-32D

SNAP-IDC-32DN

Input Range

10 to 32 VDC

-10 to -32 VDC

2.5 to 12 VDC

-2.5 to -12 VDC

Nominal Voltage Range

24 VDC

-12 to -24 VDC

2.5 VDC

-2.5 VDC

Input Resistance

20 K ohms

20 K ohms

3 K ohms

3 K ohms

Logic Voltage and Current

5 VDC ± 0.1 @ 150 mA

5 VDC ± 0.1 @ 150 mA

Maximum Operating
Common Mode Voltage

250 V

250 V

250 V

250 V

Isolation: Field to Logic

1500 V

1500 V

1500 V

1500 V

Input Arrangement

32 input channels; 4 groups of 8 inputs each

32 input channels; 4 groups of 8 inputs each

Common connection

Points in each group share a common
negative connection.

Points in each group share a common
positive connection.

Points in each group share a common
negative connection.

Points in each group share a common
positive connection.

Channel-to-Channel Isola­tion

No channel-to-channel isolation;
100 V group-to-group isolation

No channel-to-channel isolation;
100 V group-to-group isolation

Hold-down screws
Connector screws

Torque: Not to exceed 1 in-lb (0.11 N-m)
Torque: 5.22 in-lb (0.59 N-m)

Torque: Not to exceed 1 in-lb (0.11 N-m)
Torque: 5.22 in-lb (0.59 N-m)

Maximum Number of HDD Modules on One Mounting Rack

16

16

16

16

Indicators

None; use optional OptoTerminal-G20 diagnostic display or breakout rack.

ON Voltage

10 VDC @ 0.5 mA

-10 VDC @ 0.5 mA

2.5 VDC @ 0.5 mA

-2.5 VDC @ 0.5 mA

OFF Voltage

3 VDC @ 0.1 mA

-3 VDC @ 0.1 mA

1 VDC @ 0.1 mA

-1 VDC @ 0.1 mA

Polling time from I/O pro­cessor to module1

2–30 ms typical2

2–30 ms typical2

2–30 ms typical2

2–30 ms typical2

Input Turn-On/Off Time

6 ms

6 ms

6 ms

6 ms

Counting Frequency
(DC input)

0–50 Hz @ 50% duty cycle

0–50 Hz @ 50% duty cycle

0–50 Hz @ 50% duty cycle

0–50 Hz @ 50% duty cycle

Operating Temperature

-20 to 70 °C

-20 to 70 °C

-20 to 70 °C

-20 to 70 °C

Storage Temperature

-40 to 85 °C

-40 to 85 °C

-40 to 85 °C

-40 to 85 °C

Agency Approvals

UL, CE, RoHS, DFARS; UKCA

CE, RoHS, DFARS

CE, RoHS, DFARS

CE, RoHS, DFARS

Warranty

Lifetime

Lifetime

Lifetime

Lifetime

1 Affects turn-on and turn-off determination
2 Time varies based on the SNAP PAC I/O processor (brain or on-the-rack controller), processor configuration, and Ethernet host communication activity.

Comparison Chart: SNAP 4-Channel and High-Density Digital Modules

This document compares 4-channel and high-density SNAP digital I/O modules.

Obsolete SNAP High-Density Digital I/O Modules Technical Note

This technical note contains information you may need about obsolete SNAP High Density Digital I/O
modules you’re still using. Included are part numbers, descriptions, specifications, wiring diagrams, and
dimensional drawings. In most cases, these parts have been removed from data sheets because we no longer
sell them.

This document includes information on the following obsolete SNAP high density digital IO modules:

Opto 22 RoHS 3 Statement of Compliance - Restriction of Hazardous Substances

This document is a statement of compliance with the EU Directive 2015/863/EU, Restriction of Hazardous Substances (RoHS 3). This document lists Opto 22 products that comply with the substance restrictions of the RoHS 3 directive.

Using ioDisplay 6.0 with SNAP High-Density Digital Modules Technical Note

This technical note is for customers using SNAP high-density digital modules with ioControl 6.1 and ioDisplay 6.0.

CE Declaration: Low Voltage

This document is the Manufacturer's Declaration for the listed products as mentioned in the attachment - to which this confirmation refers - that they are in accordance with the mentioned European, international and/or national standards and regulations.

No downloads are available for this product.

Video: SNAP PAC System Overview

This overview describes the four integrated components of the SNAP PAC system: software, controllers, brains and I/O. This hardware and software system is designed for industrial control, remote monitoring and data acquisition.

Video: Securing SNAP Module

A quick overview on securing a SNAP Module to a SNAP rack.

Video: Removing a SNAP Module

A quick overview on removing a SNAP module.

Accuracy vs Resolution

What's the difference between accuracy and resolution in analog I/O specifications? Try your own specs in the calculator.